Intel and Submer Illuminate the Path to Immersion Cooling for 1000W TDP  

Intel and Submer Solutions Reach Momentous Heat Dissipation 

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Intel and Submer achieve breakthrough in single-phase immersion cooling.

Intel and Submer’s robust technological collaboration aimed at establishing a formidable foundation for single-phase immersion technology has achieved a groundbreaking advancement in the form of the Forced Convection Heat Sink (FCHS) package. Set to revolutionize datacenter cooling, the FCHS reduces the quantity and cost of components required for comprehensive heat capture and the dissipation of chips with Thermal Design Power (TDP) exceeding 1000W.  

Many have challenged the technological runway of single-phase immersion cooling. The Forced Convection Heat Sink is the undeniable proof that immersion is here to compete head-on with other liquid cooling technologies, including Direct Liquid Cooled water-based cold plates.” 

Daniel Pope, Co-Founder and CEO of Submer 

Enabling the Cooling of CPUs for Generations to Come 

Marking the first milestone in the journey towards the 1kW+ chip, Submer and Intel’s immersion cooling 800W+ Xeon processor with Forced Convection Heat Sink (FCHS™) technology delivers an array of key highlights for the datacenter industry.  

Pure Innovation 

The FCHS package combines the efficiency of forced convection with passive cooling, enabling the cooling of high TDP CPUs and GPUs in single-phase immersion systems. Its fail-proof design also enables natural convection in the event of propeller failure.  

Cost-Efficiency  

The FCHS is not only highly efficient but also cost-effective. Its components are cheap to manufacture and even present the possibility of being 3D printed.  

Versatile Integration 

Designed for easy retrofitting into any existing server and immersion tank setups, the FCHS empowers datacenters to swiftly handle high-density compute workloads.  

Competitive Thermal Performance 

The FCHS delivers thermal resistances that rival those of Direct Liquid Cooling (DLC), making it a formidable competitor in the liquid cooling landscape. If desired, the package returns thermal management to the server by enabling BIOS PWM control. 

Future-Proof 

This technological breakthrough paves the way for even higher TDPs and future collaborations, solidifying single-phase immersion as a leading cooling solution. 

An immersion heat sink utilizing forced convection is a key innovation in taking single-phase immersion cooling beyond the current barriers allowing single-phase immersion not only to be a solution of today but also a solution of the future!” 

Mohan J Kumar, Intel Fellow 

The FCHS is undoubtedly a momentous event in the world of cooling, providing a simple, cost-effective solution for cooling chips up to the 1000W range in single-phase immersion systems. The FCHS package will be officially debuted on the 17th-19th of October 2023 at the OCP Global Summit with live demonstrations showing results in real-time. All the details of this technology can be found in Intel and Submer’s case study.

About Submer  

Founded in 2015, Submer provides best-in-class technology, enabling datacenters around the world to leverage the power of immersion cooling for HPC, hyperscale, datacenters, Edge, AI, DL, and blockchain applications. Submer is headquartered in Barcelona, Spain, and operates a Gigafactory in Houston, Texas. For more information, visit submer.com

About Intel  

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better. To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com

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