Computing and Cooling Where you Need them!

Our Edge-ready, plug-and-play, datacenter-in-a-box solution delivers unprecedented high density and efficient infrastructure anywhere. Be it a warehouse, office building, in the heart of a city or in a remote area with harsh-climate conditions and far from the grid, the MicroPod will be fit for the job.

 

 

 

 

 

 

The benefits of the MicroPod

  • Low energy footprint

  • Save 25-40% on TCO

  • Up to 7 kW of compute density in a compact space

  • Reduce latency and increase speed deployment

  • +30% in HW life-span

  • -60% in HW failure rate

  • Save 50% on CAPEX building costs

  • Save 95% on cooling OPEX

  • Zero water consumption

  • Re-use of heat

Submer MicroPod

MicroPod

Technical specs

Heat dissipation capacity (kW) Outdoor configuration: 5 kW (in direct sunlight)
Indoor configuration: 6.7 kW
IT gear capacity (U) 19-21 inch / 6 U , 800 mm max depth
Dimensions, L x W x H (cm, in) 150 (L) x 84 (W) x 122 (H) cm
59.1 (L) x 33.1 (W) x 48 (H) in
Communications Multiple options for integrated pass-through patch panel and cable management / Ethernet port
Ambient air temperature min-max -5 °C - 46 °C
23 °F - 114.8 °F
Water requirement None
Power supply options (CE) 230V 1 50 Hz
(UL) 240V / 1 / 60 Hz

Case Studies

Telecommunications Telecommunications

  • Problems: How to place high density compute at the edge.
  • Solution: MicroPod based on x86 High density compute.
  • Advantages: Enable better services for next generation Telecommunications & reduce heat challenges on the infrastructure.

Smart Transportation Smart Transportation

  • Problems: How to replace old compute & build an intelligent compute system at the Edge, to provide new services to be delivered.
  • Solution: MicroPod based on x86 High density compute.
  • Advantages: Reduce the operating costs & increase the Service revenue to the new platform.

Emergency Service Emergency Service

  • Problems: Rapid deployment of Emergency Service infrastructure in unknown or harsh environments.
  • Solution: MicroPod based on x86 Hardware with ruggedised casing.
  • Advantages: Rapid Plug & Play and Lift-and-shift capability.

SmartBuildings SmartBuildings

  • Problems: How to reduce latency & build highly-dense compute platforms for new services at the Edge in such locations.
  • Solution: MicroPod based on x86 Hardware & AI based software.
  • Advantages: Enable greater efficiency, new services & reduces support & maintenance costs.

Office systems Office systems

  • Problems: Provide a small, efficient compute service, noise free, environmentally friendly to enable multiple new services per office location.
  • Solution: MicroPod based on x86 Hardware & various based software.
  • Advantages: Enable greater efficiency and sustainability, new services & reduce maintenance costs. It also enables adoption of Immersion Cooling benefits. .

Immersion Cooling at the Edge

Submer’s MicroPod is the perfect Immersion Cooling solution for Edge applications, colocation datacenters, telcos and cloud computing. Thanks to its compact, modular, plug-and-play, datacenter-in-a-box configuration, the MicroPod allows for fast deployment in any location, including direct sunlight and an easy plug-and-play installation with an unrivalled energy footprint anywhere on the globe.

Submer Services

  • Facility Analysis

  • Design & Planning

  • Deployment & Activation

  • Certified Immersion Hardware

  • All Necessary Certifications

  • Preventive and Corrective Maintenance

  • Control and Warranties

  • Partnership and Friendship along the way (this is for free)

Get in touch with us!

Ask questions, tell us more about your upcoming datacenter/HPC or Hyperscale project. We're here to help.