Computing and Cooling: Where You Need Them!

Our edge-ready, plug and play, datacenter in-a-box solution delivers unprecedented high density and efficient infrastructure anywhere. Be it a warehouse, office building, in the heart of a city or in a remote area with harsh-climate conditions far from the grid, the MicroPod will be fit for your purpose.

 

 

 

 

 

 

The benefits of the MicroPod

  • Low energy footprint

  • Save 25-40% on TCO

  • Up to 7 kW of compute density in a compact space

  • Fast deployment

  • +30% in HW life-span

  • -60% in HW failure rate

  • Save 50% on CAPEX building costs

  • Save 95% on cooling OPEX

  • Reduce water consumption

  • Potential heat recovery

Submer MicroPod

MicroPod

Technical specs

Heat dissipation capacity (kW) Outdoor configuration: 5 kW (in direct sunlight)
Indoor configuration: 6.7 kW
IT gear capacity (U) 19 inch / 6 U , 800 mm max depth
OCP Solutions under request
Dimensions, L x W x H (cm, in) 150 (L) x 84 (W) x 122 (H) cm
59.1 (L) x 33.1 (W) x 48 (H) in
Communications Multiple options for integrated pass-through patch panel and cable management / Ethernet port
Ambient air temperature min-max -5 °C - 46 °C
23 °F - 114.8 °F
Water requirement None
Power supply options (CE) 400 V / 3 / 50 Hz - (UL) 208 V / 3 / 60 Hz

Coming soon:
(CE) 230V / 1 / 50 Hz. - (UL) 240V / 1 / 60 Hz
Download technical specs

Case Studies

Telecommunications Telecommunications

  • Problems: How to place high density compute at the edge.
  • Solution: MicroPod based on x86 High density compute.
  • Advantages: Enable better services for next generation Telecommunications & reduce heat challenges on the infrastructure.

Smart Transportation Smart Transportation

  • Problems: How to replace old compute & build an intelligent compute system at the Edge, to provide new services to be delivered.
  • Solution: MicroPod based on x86 High density compute.
  • Advantages: Reduce the operating costs & increase the Service revenue to the new platform.

Emergency Service Emergency Service

  • Problems: Rapid deployment of Emergency Service infrastructure in unknown or harsh environments.
  • Solution: MicroPod based on x86 Hardware with ruggedised casing.
  • Advantages: Rapid Plug & Play and Lift-and-shift capability.

SmartBuildings SmartBuildings

  • Problems: How to reduce latency & build highly-dense compute platforms for new services at the Edge in such locations.
  • Solution: MicroPod based on x86 Hardware & AI based software.
  • Advantages: Enable greater efficiency, new services & reduces support & maintenance costs.

Office systems Office systems

  • Problems: Provide a small, efficient compute service, noise free, environmentally friendly to enable multiple new services per office location.
  • Solution: MicroPod based on x86 Hardware & various based software.
  • Advantages: Enable greater efficiency and sustainability, new services & reduce maintenance costs. It also enables adoption of Immersion Cooling benefits. .

Compatible with any IT hardware

  • Asus

Efficient packaged solutions
for the Industry

  • HPC Solutions

  • Edge Solutions

  • AI and ML Solutions

  • Cloud Solutions

Submer Services

  • Facility Analysis

  • Design & Planning

  • Deployment & Activation

  • Certified Immersion Hardware

  • All Necessary Certifications

  • Preventive and Corrective Maintenance

  • Control and Warranties

  • Partnership and Friendship along the way (this is for free)

Immersion Cooling at the Edge

Submer’s MicroPod is the perfect Immersion Cooling solution for Edge applications, colocation datacenters, telcos and cloud computing. Thanks to its compact, modular, plug-and-play, datacenter-in-a-box configuration, the MicroPod allows for fast deployment in any location, including direct sunlight and an easy plug-and-play installation with an unrivalled energy footprint anywhere on the globe.

Get in touch with us!

Ask questions, tell us more about your upcoming datacenter/HPC or Hyperscale project. We're here to help.