Also known as liquid submersion cooling. It is the practice of submerging computer components (or full servers) in a thermally, but not electrically, conductive liquid (dielectric coolant) allowing higher heat transfer performance than air and many other benefits.
The very first commercially available Immersion Cooling system designed according to OCP principles. A compact, modular LIC solution with >50kW dissipation capacity and a PUE <1.03. Accommodating 21” and/or 19” HW and a flexible busbar system supporting multi-zone 12v & 48v configurations.
The very first commercially Immersion Cooling system designed according to OCP principles. A compact, modular LIC solution with >100kW dissipation capacity and a PUE <1.03. Accommodating 21” and/or 19” HW and a flexible busbar system supporting multi-zone 12v & 48v configurations.
Achieve a PUE 1.03
Save 25-40% on TCO
Up to 100kw of compute density
Reduce latency and increase speed deployment
+30% in HW life-span
-60% in HW failure rate
Save 50% on CAPEX building costs
Save 95% on cooling OPEX
Reduce water consumption
Potential re-use of heat
HPC Solutions
Edge Solutions
AI and ML Solutions
Cloud Solutions
Want to roll-out Immersion Cooling in your new or existing infrastructure?
Submer delivers turnkey Immersion Cooling technology including primary cooling, secondary cooling, resilient pump-sets all the way to certified hardware with a guaranteed unrivalled end to end PUE, anywhere on the globe.
Compare an air cooled and a Submer cooled Datacenter.
If you haven't ever heard about Immersion Cooling... If you're just curious about liquid and electronics coexisting... Or if you want to make your datacenter smarter and more sustainable... This Submer eBook will answer your W's!
Ask questions, tell us more about your upcoming datacenter/HPC or Hyperscale project. We're here to help.
